摘要
针对硅、聚合物和工程陶瓷等典型微机械材料 ,采用KrF准分子激光对其进行了加工技术研究 ,分析了加工规律 。
Through KrF laser etching of typical MEMS materials such as silicon, PMMA and engineering ceramic materials, the etching process is analyzed. As for excimer laser, its most suitable application environment and conditions are discussed.
出处
《航空制造技术》
2000年第2期26-27,39,共3页
Aeronautical Manufacturing Technology
基金
陕西省自然科学基金