晶圆贴膜金刚刀划片工艺

The wafer dicing process film diamond knife

为提高生产效率,降低人工劳动强度,在对比砂轮划片和金刚刀划片2种工艺方法优缺点的基础上,采用晶圆贴膜金刚刀划片的工艺方法,通过控制划片工艺过程各工艺参数,实现铌酸锂单晶的划片.该方法不但改善了划片的质量,而且提高了划片成品率.经批量生产实践证明,晶圆贴膜金刚刀划片工艺是可行的;对生产企业而言,可以在不购买其他设备的基础上,提高生产效率和划片成品率.

In order to improve production efficiency,reduce labor intensity,based on the contrast of advantages and disadvantages between grinding wheel dicing and diamond knife dicing process methods,the methods of the wafer dicing film diamond knife process was used,the dicing process of lithium niobate single crystal was completed by controlling the dicing process parameters.This method not only improves the quality of dicing but also increases dicing yield.Mass practice proved that the wafer film diamond knife dicing process is feasible;and for the manufacturing enterprise,production efficiency and dicing yield can be increased meantime,but there is no need for invest in equipment.