摘要
通过实验数据及图表论述了化学镀 Ni- Cu- P的工艺条件 ,探讨了镀液的主要组成成分、镀液的 p H值、施镀时间对镀层中 Ni、Cu、P质量百分含量、镀层的沉积速度的影响 。
Technology of electroless plating of Ni Cu P alloy was investigated through a great deal of experiments. Influence of components and pH of the bath and plating time on the percentage content of Ni Cu P in the coating and the deposition rate of the alloy were discussed and tendency of coating components with changing technology paraments was summarised.
出处
《腐蚀与防护》
CAS
2000年第3期126-128,139,共4页
Corrosion & Protection