化学镀Ni-Cu-P合金工艺研究

STUDY OF TECHNOLOGY OF ELECTROLESS PLATING OF Ni-Cu-P ALLOY

通过实验数据及图表论述了化学镀 Ni- Cu- P的工艺条件 ,探讨了镀液的主要组成成分、镀液的 p H值、施镀时间对镀层中 Ni、Cu、P质量百分含量、镀层的沉积速度的影响 。

Technology of electroless plating of Ni Cu P alloy was investigated through a great deal of experiments. Influence of components and pH of the bath and plating time on the percentage content of Ni Cu P in the coating and the deposition rate of the alloy were discussed and tendency of coating components with changing technology paraments was summarised.