激光二极管合束模块整体散热热阻分析

Analysis on Overall Thermal Resistance of Laser Diode Beam Combined Modules

半导体激光器散热是在热源至热沉之间尽可能提供一条低的热阻通路。其主要目的是降低外热阻(即激光器芯片至散热空间的热阻),使发热激光器芯片与被冷却表面之间保持一个低的温度梯度和良好的热接触。对于接触热阻冷却方法,人们往往根据自身的研究对象,用实验方法来解决接触热阻的问题。通过对单管合束模块整体热阻逐步进行分析,通过软件模拟和结合频率红移法对激光二极管热阻进行测量,得出单管合束模块整体散热热阻小于0.25℃/W。此散热模块可以满足百瓦级半导体激光器的散热要求。

Semiconductor laser cooling is to provide a low thermal resistance path between heat source and heat sink.Its main purpose is to reduce the external thermal resistance（resistance between the laser chip and the cooling space） to maintain a low temperature gradient and good thermal contact between the heating laser chip and cooling surface.Experimental methods are used to solve the problem of contact resistance according to the study object.Based on the single-chip combined beam module,a overall thermal resistance is analyzed gradually,software simulation and the frequency with red shift method are described for the thermal resistance of laser diode measurement.Single-chip combined beam module overall thermal resistance is less than 0.25 ℃/W.The cooling modules can be used in the 100 W-class semiconductor laser cooling requirements.