基于铜铝基板和热沉组合的LED散热性能的研究

Research on LED Heat Dissipation Performance of Combination of Substrate and Heat Sink Based on Brass and Aluminum

大功率LED具有节能环保、发光效能高等诸多优点,但是散热问题制约了它的快速发展。本文针对CREE公司6W大功率LED芯片,测试其基于铜铝材料基板与热沉组合的散热性能、光电性能及热分布,从而对所涉及的材料和结构进行反馈改进,实现对LED芯片的基板与热沉的最优选择。通过对原理和实验结果的分析,得出黄铜的散热性能并不差,黄铜和铝的基板热沉混合组合其散热效果与性能表现要好于同种材料的组合,并指出提高LED散热能力的关键是散热结构与散热面积。

Although high power LED has its advantages of energy saving and high luminous efficacy, cooling problems have constrained its rapid development. Cooling performance, optical properties and heat distribution are tested in this paper with CREE 6W LED chip based on substrates and heat sinks with different materials, and thus the materials and the structure involved are improved to achieve the optimal choice of LED chip substrate and heat sink. The cooling effect of brass material is not bad, and the performance of the combination of a mixture of brass and aluminum is better than that of the same combinations through analysis, and it is pointed out that the key to improve the capacity of LED cooling is the structure and area of cooling.