导电胶性能的影响因素与表征

The Performance and Characterization of Conductive Adhesives

导电胶有着铅锡焊条没有的好处,所以它作为传统的锡铅焊料的替代品,已经得到了人们越来越多的关注。对于导电胶的组成和功能进行了阐述,介绍了导电胶发展的国内外的现状,说明我国在导电胶方面还有很多工作要做。重点介绍了影响导电胶性能的因素有水分、高温、电化学腐蚀和外力冲击等,并且提出了一定的解决方案。也介绍了五种常见的测试和表征导电胶性能的方法。提出了导电胶未来发展的几个方向,对导电胶的前景进行了展望。

Conductive adhesive has advantages which tin-lead solder doesn＇t. So it has already got more and more attentions as a substitute of traditional tin-lead solder. The composition and function of conductive adhesive is discussed, the development of conductive adhesive at home and abroad is introduced, and it is illustrated that there are still lots of work to do about conductive adhesive. This paper focuses on the influencing factors which have effects on the properties of conductive adhesive, such as high temperature, water, electrochemical corrosion and external shocks, and pro- poses some solutions. And 5 common test and characterization methods for conductive adhesive properties are introduced. Several future development directions of conductive adhesive are also presented as well as the prospect.