摘要
介绍了红外成像信号检测技术的发展及现状、二维混合红外焦平面阵列 (IR FPAs)的基本概念和单元结构 ,并结合 BDI和 CTIA两种读取电路对红外成像信号检测技术的工作原理进行了阐述。
This paper introduces the development and prensent situation of infrared imaging technology.The conception and cell structure of hybrid infrared facal-plane arrays of two dimentions are presented too.The paper also discusses the characteristic of signal detection technology based on the BDI and CTIA.
出处
《电子工程师》
2000年第5期42-44,共3页
Electronic Engineer
关键词
红外成像
信号检测
红外焦平面阵列
infrared facal-plane arrays, detector, readout circuit
