摘要
在电子工业中 ,为消除铅的污染 ,探讨了各种替代Sn-Pb合金的无铅可焊性镀层。论述了电镀Sn -Zn、Sn-Ag、Sn-Bi合金的方法及其镀层的可焊性能。
Concerns regarding the toxicity of lead for safety and environment have caused electronic and electronics industries to focus on lead-free substitutes for solder.The electrodeposition of Sn-Zn,Sn-Ag and Sn-Bi alloy are repeated.The solderability of lead-free alloy coating is discussed.
出处
《电子工艺技术》
2000年第3期98-100,共3页
Electronics Process Technology
关键词
电镀
无铅锡合金
可焊性
电子工业
Electroplating
Lead-free tin alloy
Solderability
