摘要
在SMT焊点三维形态预测结果的基础上 ,生成了分析焊点力学性能的三维实体模型 ,设计了自动接合焊点形态预测与可靠性分析的接口程序。
A three-dimensional solid mechanical model for analyzing the mechanical behavior of solder joints is created according to the results of predicting the shape of SMT solder joints.A program is developed to integrate automatically solder joint shape prediction and reliability analysis.
出处
《电子工艺技术》
2000年第3期101-103,共3页
Electronics Process Technology
