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多孔结构毛细芯蒸发器传热特性的实验研究 被引量:1

Experimental Investigation on Heat Transfer Characteristics for Capillary Wick Evaporators
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摘要 本文针对不同压力条件下不同换热表面结构的毛细结构蒸发器气(?)液相变传热特性进行了实验研究。选取微槽道结构和烧结丝网结构的换热表面分别在蒸发压力为0.86×10~5 Pa、0.91×10~5 Pa、0 96×10~5 Pa、1.0×10~5 Pa、1.5×10~5 Pa、2.0×10~5 Pa条件下进行了传热特性研究并对其实验结果进行对比,结果表明,压力对换热系数有重要的影响,当压力范围为0.86×10~5~1.0×10~5 Pa时,在过热度相同的条件下,随着压力的增加,换热系数呈上升趋势;在较大压力的条件下,换热系数随着过热度的增加呈先升后降的趋势。 Heat transfer characteristics for the different heat transfer surface structure at the different pressure conditions were investigated.The operational pressures in this study was in the range of 0.86×10~5~2.0×10~5 Pa,and heat transfer characteristics of the micro-channel structure and sintered screen structure were experimentally studied and compared.The experimental results showed that the operational pressure has an significantly effect on heat transfer coefficient.Heat transfer coefficient improved with the increase pressure in the range of 0.86×10~5~1.0×10~5 Pa at the same superheat condition.At the higher operational pressure,heat transfer coefficient first improved with the increase of superheat then dropped after reaching a certain value.
出处 《工程热物理学报》 EI CAS CSCD 北大核心 2012年第5期843-846,共4页 Journal of Engineering Thermophysics
基金 北京市教委创新人才项目(No.004000543111516)
关键词 毛细芯蒸发器 压力 过热度 传热特性 capillary wick evaporator pressure superheat heat transfer characteristics
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参考文献4

  • 1赵耀华,刘建荣,刁彦华,杨开篇,康晓龙.微槽群相变散热器传热性能的实验研究[J].工程热物理学报,2008,29(5):825-827. 被引量:4
  • 2Hanlon M A,Ma H B.Evaporation Heat Transfer in Sintered Porous Media[].Journal of Heat Transfer.2003
  • 3Li C,Peterson G P.Evaporation/boiling in thin capillary wicks (II) - effects of volumetric porosity and mesh size[].Journal of Heat Transfer.2006
  • 4Wang J L,Catton I.Enhanced evaporation heat transferin triangular grooves covered with a thin fine porous lay-er[].Applied Thermal Engineering.2001

二级参考文献7

  • 1胡学功,颜晓虹,赵耀华.微槽群蒸发器在电子芯片冷却方面的应用[J].化工学报,2005,56(3):412-416. 被引量:17
  • 2颜晓虹,胡学功,赵耀华.微槽群相变式微冷系统的换热特性实验[J].中国科学院研究生院学报,2006,23(3):313-316. 被引量:3
  • 3S Belhardj, S Mimouni, A Saidane, et al. Using Microchannels to Cool Microprocessors: a Transmission- Line-Matrix Study. Microelectronics Journal, 2003, (34): 247-253.
  • 4Nakayama W. Forced Convective/Conductive Conjugate Heat Transfer in Microelectronic Equipment. Annual Review of Heat Transfer, 1997, 8:1-48.
  • 5Hesroni G, A Mosyak, Z Segal, et al. A Uniform Temperature Heat Sink for Cooling of Electronic Devices. Inter. J . Heat Mass Transfer, 2002, 45:3275-3286.
  • 6Hu Xuegong, Zhao Yaohua, Yan Xiaohong. A Novel Micro Cooling System for Electronic Devices Using a Micro Capillary Groove Evaporator. Journal of Enhanced Heat Transfer, 2004, 11(4): 407-415.
  • 7谢德仁.电子设备热设计工作点评[J].电子机械工程,1999,15(1):26-28. 被引量:22

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同被引文献7

  • 1刁彦华,赵耀华,王秋良.R-113池沸腾气泡行为的可视化及传热机理[J].化工学报,2005,56(2):227-234. 被引量:21
  • 2Jhan-Hong Liou,Chia-Wei Chang,Chi Chao,Shwin-Chung Wong.Visualization and thermal resistance measurement for the sintered mesh-wick evaporator in operating flat-plate heat pipes[J].International Journal of Heat and Mass Transfer.2009(7)
  • 3Chen Li,G.P. Peterson.The effective thermal conductivity of wire screen[J].International Journal of Heat and Mass Transfer.2006(21)
  • 4R. Kempers,D. Ewing,C.Y. Ching.Effect of number of mesh layers and fluid loading on the performance of screen mesh wicked heat pipes[J].Applied Thermal Engineering.2005(5)
  • 5Andreas Brautsch,Peter A Kew.Examination and visualisation of heat transfer processes during evaporation in capillary porous structures[J].Applied Thermal Engineering.2002(7)
  • 6李时娟,曲伟.平板热管在毛细极限下的传热能力研究[J].工程热物理学报,2009,30(2):315-317. 被引量:8
  • 7刘进荣.压力对水平管束外池沸腾传热性能的影响[J].化学工程,1998,26(3):15-17. 被引量:3

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