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一种耐高温聚酰亚胺胶粘剂的合成 被引量:5

Synthesis of high temperature-resistant polyimide adhesive
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摘要 以醚胺(ODA)、砜胺(DDS)和醚酐(ODPA)、酮酐(BTDA)为原料,采用冷却法和加热法分别合成了一种耐高温聚酰亚胺胶粘剂。通过搭接试验和聚酰亚胺膜结构表征,比较了两种不同合成方法所得聚酰亚胺胶粘剂的性能差异。通过试验选择了亚胺胶的搭接工艺和固化工艺,从而使聚酰亚胺胶粘剂的粘接性能达到最佳。 With 4,4'-diamino diphenyl ether(ODA),4,4'-aminophenyl sulfone(DDS),3,3',4,4'-Diphenyl ether tetracarboxylic dianhydride(ODPA) and 3,3',4,4'-benzophenone tetracarboxylic dianhydride(BTDA) as main raw materials,a high temperature-resistant polyimide adhesive was snythesised by cooling method and heating method.Using the lapping test and polyimide structure characterization,we compared the property differences of adhesives between two different snythetic methods.In the maintime,choosing the lapping process and curing process of poiyimide adhesive by experiments,the adhesion property of PI adhesive was much better.
出处 《化工新型材料》 CAS CSCD 北大核心 2012年第4期43-45,共3页 New Chemical Materials
关键词 耐高温聚酰亚胺胶粘剂 冷却法和加热法 粘接性能 搭接工艺和固化工艺 high temperature-resistant polyimide adhesive cooling method and heating method adhesion property lapping process and curing process
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  • 1易昌凤,李全涛,徐祖顺.超支化聚酰亚胺的研究进展[J].化学进展,2007,19(2):356-361. 被引量:18
  • 2Polyimides-Fundamentals and Applications (eds.Ghosh M K,Mittal K L).NY:Marcel Dekke,1996.
  • 3Jung M S,Lee T W,Hyeon-Lee J Y,et al.Polymer,2006,47:2670-2676.
  • 4Flory P J.J.Am.Chem.Soc.,1952,74:2718-2723.
  • 5Kim Y H,Webster O W.J.Am.Chem.Soc.,1990,112:4592-4593.
  • 6Unal S,Long T E.Macromolecules,2006,39:2788-2793.
  • 7Hutchings L R,Roberts-Bleming S J.Macromolecules,2006,39:2144-2152.
  • 8Jung Y D,Park S K,Ju J J,et al.Macromol.Chem.Phys.,2003,204:410-416.
  • 9Xu K,Economy J.Macromolecules,2004,37:4146-4155.
  • 10Thompson D S,Markoski L J,Moore J S.Macromolecules,1999,32:4764-4768.

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