Mo-Cu复合材料的研究进展

Progress of Mo-Cu Composites

概述了国内外Mo-Cu复合材料的进展,Mo-Cu复合材料在电子封装、高压真空电触头和热沉材料等方面的应用,它的高导热、导电性能,高的强度及低的热膨胀系数等优越性能,及其传统的和最新的制备工艺。

In terms of Mo-Cu composites,following points were summarized,including the progress at home and abroad;the applications to electronic packagings,high voltage vacuum electrical contact and heat sink materials;the properties such as high thermal and electronic conductivities,high strength and low thermal expansion coefficient;and the traditional and up-to-date preparing processes.