摘要
本论文针对13.56MHz双界面智能卡芯片(通信标准遵循ISO/IEC14443 type A)在非接模式下的中间场强(3A/m-6A/m)中出现的交互失败(盲区问题)进行了测试和分析,并对以前芯片中的模拟前端部分的限幅器和电源模块重新进行电路和版图设计。论文中该芯片采用SMIC 0.18μm CMOS eflash工艺进行设计与仿真,并流片验证。
This paper described the test,analysis and solution of the blind area in the smartcard which follows the SO/IEC14443 type A protocol between the communication.The chip was designed,simulated and fabricated in the SMIC 0.18μm eflash CMOS process successfully.
出处
《中国集成电路》
2012年第4期38-42,共5页
China lntegrated Circuit
