摘要
随着刚挠板朝高密度,薄型化的发展,其挠板尺寸涨缩与一致性的问题已成为各厂家密切关注的问题,本文分析了刚挠板挠板尺寸涨缩的原因及主要产生涨缩的过程,并针对性地提出了改善措施。
With the development of high density and thin rigid-flex PCB,the problem of flex base material's reduction and enlargement has attracted increasing attention.This page tried to analyze the cause and course of flex base material's reduction and enlargement,and provide focused enhanced measures.
出处
《印制电路信息》
2012年第5期62-65,共4页
Printed Circuit Information
关键词
刚挠板
尺寸涨缩
原因分析
改善措施
rigid-flexed
MLB
reduction and enlargement
analyze enhanced measures