摘要
现代微波电路大多采用厚膜或薄膜陶瓷基板制作，焊接区为股导体，其焊接性直接影响电路的可靠性。研究了真空处理、气氛下处理等方式改变膜导体的构造，指出膜导体中玻璃相的数量、形貌、分布等对膜导体焊接性的影响。焊接工艺直接影响到膜导体焊接接头的可靠性。接头的薄弱环节是膜导体与陶瓷基极的界面。
Thick or thin film ceramic substrates are used for modem microwave circuit.Solderabilit. Solderability of film conductor as soldering pad has direct influence son reliability of circuit. Aner vacuum or atmosphere beatment, the changed composition of filmconductor is studied. It shows that the number,appearance and distribution of glass - phase in film conducto have influence onsolderability. Soldering process also has influence on joint reliability. The por area of joint is interface between film conductor andceramic.
出处
《焊接》
2000年第1期14-16,共3页
Welding & Joining
