摘要
将甲基苯基二氯硅烷(MePhSiCl2)与二甲基二氯硅烷(Me2SiCl2)、甲基乙烯基二氯硅烷(MeViSiCl2)和苯基三氯硅烷(PhSiCl3)等共水解后,在KOH催化下共缩聚,以三甲基氯硅烷(Me3SiCl)为封端剂,制备了含有甲基苯基硅氧链节的甲基苯基乙烯基硅树脂,并利用FTIR、1H NMR和热重分析(TGA)对产物进行了表征.将所得甲基苯基乙烯基硅树脂与甲基苯基含氢硅油按一定配比,在铂络合物催化下硫化成型,制成发光二极管(LED)封装A/B胶,用于LED封装.所得LED封装硅树脂固化后在可见光范围内具有非常高的透光率.对LED的封装结构进行优化,获得的LED具有高光效、高光通量、窄显色指数和高色温一致性等优点,可满足功率型LED封装要求.
A novel high refractive index and high transparent silicone resin-type material for the packaging of light emitting diode（LED） was introduced.The methylphenyl vinyl silicone resin was synthesized by cohydrolysis of MePhSiCl 2 with Me 2SiCl 2,MeViSiCl 2 and PhSiCl 3,then by co-condensation polymerization catalyzed by KOH and end-capped with Me 3SiCl.Then the silicone material for LED packaging was prepared with the produced methylphenyl vinyl silicone resin,methylphenyl hydrosilicone oil and Karstedt＇s catalyst.The methylphenyl vinyl silicone resins were characterized by FTIR and 1H NMR.The silicone resins prepared with very high transmittance at range of 400-800 nm after cured.The LED packaged with the silicone resin-type materials exhibited higher luminous flux,higher light efficiency,narrower color-rendering index and higher color-temperature consistency.
出处
《高等学校化学学报》
SCIE
EI
CAS
CSCD
北大核心
2012年第5期1078-1083,共6页
Chemical Journal of Chinese Universities
基金
国家"八六三"计划项目(批准号:2006AA03A134)
浙江省自然科学基金(批准号:Y4080264)
浙江省科技计划面上项目(批准号:2009C31081)
杭州师范大学产学研结合项目(批准号:2010CXY9103)
浙江工业大学重中之重学科开放基金(批准号:20110941)
浙江省新苗计划项目(批准号:2011R421048)资助
关键词
发光二极管
封装
甲基苯基乙烯基硅树脂
高折光率
Light emitting diode
Packaging
Methylphenyl vinyl silicone resin
High refractive index
