VL020回流炉中半导体激光器芯片In焊接研究

Research on Indium Solder of Semiconductor Laser Chip in VL020 Reflow

利用VL020真空烧结炉,选用In焊料对半导体激光器芯片的焊接技术进行较为深入的研究,分别对焊接时气体保护、焊接前期芯片、热沉的处理、真空工艺过程压力的施加、夹具设计和烧结工艺曲线等因素进行实验分析。结果表明,以上参数对半导体激光器芯片的焊接均有显著的影响,在N2/H2体积分数为95%/5%气体的保护下,通过对夹具施加适当的静压力,In焊料与Au能够充分和快速润湿,实现较高的焊接质量。蔡司显微镜检测结果表明,采用焊接技术可以使半导体激光器芯片具有较低的空洞率,高达90%以上的焊透率,其焊接过程主要通过夹具装配完成,人为影响因素少,成品率高,并适用于小批量生产。

The welding technology used for choosing indium solder of semiconductor laser chip in VL020 vacuum sintering furnace was deeply studied. Through VL020 vacuum sintering furnace, these factor that gas protection, welding pre-chip, the treatment of heat sink, imposing pressure of the vacuum technics process, fixture design and sintering process curve analysis of other factors during welding were analyzed respectively. The results show that the parameters mentioned had a significant influence on welding the semiconductor laser chip. With the protection of the NJH2 （95% / 5% ） gas, through imposing appropriate static pressure to the fixture, indium solder and gold can fully and fastly wet to achieve a higher quality of welding. The results show that welding on the semiconductor laser chip solder with Zeiss microscope check has a low empty rate, the penetration rate is up to 90% , the welding process is mainly assembly finished through the fixture, a small man-made factors, high finished product rate and suitable for small batch production.