无铅焊料用水基无卤无VOC助焊剂

Halogen-free,VOC-free,and water-based flux for lead-free solders

采用无卤素有机酸和有机胺作为活化剂,以去离子水为溶剂,并添加非离子表面活性剂,通过铺展率实验对各主要成分及配比进行选择和优化设计,研究了一种无铅焊料用水基无卤无VOC助焊剂。依据电子行业标准对研制的助焊剂进行了性能测试。结果表明,制备的助焊剂不含卤素、VOC物质,对无铅焊料的润湿性强,焊点光亮饱满,焊后残留少,铺展率可达78.2%,适用于SnAgCu和SnCu无铅焊料的波峰焊。

Halogen-free organic acids and amines were used as the active agents, the deionized water was employed as the solvent and non-ionic surfactants were added, by performing the spreading rate measurements, components were selected and composition was optimized for the halogen-free, VOC-free and water-based flux for lead-free solders. The performance tests were implemented according to the current electronic industry standard. The results show that the flux has strong wettability, full bright spot and little residual without halogen and VOC materials; the spreading rate is up to 78.2%. The flux can be used in the waving soldering process for SnAgCu and SnCu lead-free solders.