摘要
综述了近几年来中温固化环氧树脂(EP)体系的最新研究进展,详细介绍了双氰胺、酸酐和咪唑等常用固化剂及其促进剂的固化机制,最后对EP中温固化体系未来的研究方向进行了展望。
The research progress of epoxy resin（EP） systems with moderate temperature curing was summarized in recent years. The curing mechanisms of some commonly used curing agents（such as dicyandiamide,acid anhydride,imidazole and other curing agents） and accelerants were in detail introduced. Finally,the future research directions of EP systems with moderate temperature curing were expected.
出处
《中国胶粘剂》
CAS
北大核心
2012年第3期54-58,共5页
China Adhesives
关键词
环氧树脂
双氰胺
咪唑
酸酐
epoxy resin（EP）
dicyandiamide
imidazole
acid anhydride
