摘要
采用半导体工艺的旋转涂胶法,在矩形铁氧体衬底上旋涂抗蚀剂,研究了其涂覆特性,给出了抗蚀剂的厚度与旋涂转速和旋涂时间的关系曲线及均匀性。随着旋涂转速的提高,抗蚀剂的厚度逐渐减薄;当旋涂转速大于2500r/min时,抗蚀剂厚度差小于5%。同时,随着旋涂时间的延长,抗蚀剂厚度也会减小,并最终趋向一个恒定值;当旋涂时间长于20s时,抗蚀剂厚度差小于5%。最后,分析了旋涂中心对抗蚀剂旋涂性能的影响。
Resist was coated on the rectangular ferrite substrate by spin-coating route of semiconductor technology, and the relation were investigated between thickness and uniformity of resist and the spin-coating speed and time. The thickness of resist gradually decreases with increasing spin-coating speed. For spin-coating speed of faster than 2500 r/min, the thickness difference of resist is within 5%. Meanwhile, the thickness of resist decreases with prolonging spin-coating time and finally tends to reach a constant value. The thickness difference of resist is within 5% as the spin-coating time is over 20s. At last, the effect of spin-coating center was analyzed on the spin-coating behavior.
出处
《磁性材料及器件》
CSCD
北大核心
2012年第3期37-39,共3页
Journal of Magnetic Materials and Devices
基金
中国电子科技集团公司技术创新基金资助项目(JJ1025)
关键词
铁氧体衬底
光刻
抗蚀剂
旋涂
ferrite substrate
photolithograph
resist
spin-coating