摘要
The correlation of plating structure with the antioxygenation of micro Cu-Ag bimetallic powder was studied by SEM、XRD、TG and other means.It was found that copper powder plated with silver having an interspersion structure posesses antioxygenation at normal atmospheric temperature as surface Ag content reaches above 15.22%,the temperature of oxidation resistance varies with the surface Ag content.The greater the surface Ag content is,the higher the temperature of antioxygenation for bimetalic powder with the plating interspersion structure.The copper powder plated by silver with full packaging structure can not be oxidized even at
The correlation of plating structure with the antioxygenation of micro Cu-Ag bimetallic powder was studied by SEM、XRD、TG and other means.It was found that copper powder plated with silver having an interspersion structure posesses antioxygenation at normal atmospheric temperature as surface Ag content reaches above 15.22%,the temperature of oxidation resistance varies with the surface Ag content.The greater the surface Ag content is,the higher the temperature of antioxygenation for bimetalic powder with the plating interspersion structure.The copper powder plated by silver with full packaging structure can not be oxidized even at 700℃
出处
《物理化学学报》
SCIE
CAS
CSCD
北大核心
2000年第4期366-369,共4页
Acta Physico-Chimica Sinica
