基于Moldflow的电子镇流器底壳注射成型分析

Analysis of Injection Molding For the Electronic Ballast Pan on Moldflow

利用Moldflow软件对电子镇流器底壳注射成型过程中最佳浇口位置和流动情况进行分析，确定了最佳浇口位置。通过对填充时间、气穴、熔接痕、锁模力曲线和流动前沿温度等数值模拟，预测塑件可能出现的缺陷，显示了Moldflow技术在模具开发过程中对于优化塑料注射模设计和优化注射工艺参数等方面所起到的显著作用。

Analysis was made on the optimal gate location and flow behavior in injection molding of electronic ballast pan was simulated by Moldflow and the optimal gate location was determined. Some possible defects in the products were predicted based on the numerical simulation of the filling time, the location of air pockets, weld line, clamping force curve and front temperature. It was shown that the Moldflow technology in the mold development process for optimizing plastic mold design and optimization of plastic mold injection process parameters, etc. played a significant role.