期刊文献+

高功率微波作用下热载流子引起n型金属-氧化物-半导体场效应晶体管特性退化研究 被引量:11

Research on characteristics degradation of n-metal-oxide-semiconductor field-effect transistor induced by hot carrier effect due to high power microwave
原文传递
导出
摘要 高功率微波(HPM)通过使半导体器件特性退化和功能失效,从而干扰电子系统无法正常工作.针对金属氧化物半导体(MOS)器件的HPM效应,建立了高功率微波引起n型金属氧化物半导体场效应晶体管(nMOSFET)特性退化的物理过程与模型.器件仿真结果中nMOSFET的输出特性曲线显示栅极注入HPM引起器件特性退化,包括阈值电压正向漂移、饱和电流减小、跨导减小等;结合物理模型分析可知,HPM引起的高频脉冲电压使器件进入深耗尽状态,热载流子数目增多,热载流子效应导致器件特性退化.MOS器件的HPM注入实验结果显示,器件特性曲线、器件模型参数变化趋势与仿真结果一致,验证了HPM引起nMOSFET特性退化的物理过程与模型. High power microwave (HPM) can disrupt the normal work of electronic systems through the effect of HPM on semiconductor devices. In this paper, the physical process and the physical model of the characteristic degradation of n-metal-oxide-semiconductor field-effect transistor (nMOSFET) induced by HPM are introduced. In device simulation results, the output characteristic curve of nMOSFET shows that HPM can induce the degradation of the characteristics of device, including the forward drift of threshold voltage, and the reduction of saturation current and transconductance. Based on the process and the model introduced in this paper, the voltage pulse generated by HPM makes nMOSFET be in depletion status and hot carrier increase; then the effect of hot carrier results in the characteristic degradation of device. The experimental result of MOS injected HPM shows the changes of output characteristics and model parameters are consistent with the device simulation results, proving that the physical process and the physical model introduced in the paper are correct.
出处 《物理学报》 SCIE EI CAS CSCD 北大核心 2012年第10期485-491,共7页 Acta Physica Sinica
基金 国家自然科学基金(批准号:60906051)资助的课题~~
关键词 高功率微波 n型金属.氧化物-半导体场效应晶体管 热载流子 特性退化 high power microwave, n-metal-oxide-semiconductor field-effect transistor, hot carrier, characteristics degradation
  • 相关文献

参考文献13

  • 1Hwang S M Hong J I, Han S M, Hu C S, Huh U K, Choi J S 2007 Microwave Conference 2007 APMC 2007, Asia-Pacific, Bangkok, Thailand, Decembet 1-14, 2007 pl.
  • 2Wang S M, Hong .J I, Huh C S 2008 Prog. Electrorrtag. Res. 81 61.
  • 3Kim K Iliadis A A, Victor G 2003 Semicdnductor Device Re- search Symposium, 2003 lnterncttional Washington, DC, USA, December 10-12, 2003 p530.
  • 4Kim K, Iliadis A A 20Q7 Electromag. Compat., IEEE Trans. 49 329.
  • 5F0R K, Liia0is A A 2005 Semiconductor Device Research Sympo- sium, 2005 International, Washinglon, DC, USA, December 7-9 2005 p5.
  • 6Taylor C D, Girl D V 1994 High-power Microwave Systems and Effects (Washingtoa, D.12: Francis & Taylor).
  • 7任瑞涛 2008 硕士论文(沈阳:沈阳理工大学).
  • 8Wang H Y, Li J Y, Zhou Y H, Hu B, Yu X Y 2009 Electromagnetics 29 393.
  • 9Neamen D A 2002 Semiconductor Physics and Devices Basic Principles (New York: McGraw-Hill) p537.
  • 10马晓华 2006 博士论文(西安:西安电子科技大学).

二级参考文献4

  • 1[4]Benford J and Sweegle J 1992 High Power Microwave (Boston:Artech House INC Press)
  • 2[5]Richardson R E et al 1975 IEEE Trans Compatibility 17(4) 216
  • 3[6]Wang P S et al 1998 Acta Phys. Sin. 47 485 (in Chinese)[王平山等 1998 物理学报 47 485]
  • 4[9]Yu W et al 1993 Acta Phys. Sin. 42 431 (in Chinese)[余玮等 1993 物理学报 42 431]

共引文献12

同被引文献70

引证文献11

二级引证文献31

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部