摘要
在甲醛化学镀铜镀液中加入离子液体1-乙基-3-甲基咪唑四氟硼酸盐,研究了对化学镀铜的影响。结果表明,随着离子液体质量浓度的增大,化学镀铜溶液的沉积速率降低,铜层晶粒细化,电阻增加。环境扫描电镜和X-射线衍射观察测试表明,镀层表面分布均匀,且在铜(111)晶面成核的趋势增加。电化学测试表明,随着离子液体质量浓度的增大,阳极氧化峰电位负移,氧化峰电流密度减小,进一步显示ρ(1-乙基-3-甲基咪唑四氟硼酸盐)对甲醛化学镀铜溶液沉积速率有抑制作用。
Using an ionic liquid namely 1-ethyl-3-methyl imidazolium fluoroboric acid as solvent in electroless copper plating,effects of the ionic liquid to the electroless copper plating were studied.Results showed that copper deposition rate was decreased,crystal grain was refined and resistance was increased with increase of the 1-ethyl-3-methyl imidazolium fluoroboric acid concentration.Also it was found that the deposited Cu film was uniform and nucleus formation of the Cu（111）was enhanced with the addition of 1-ethyl-3-methyl imidazolium fluoroboric acid by SEM and XRD.Electrochemical measurement indicated that anodic peak potential shifted negatively and oxidation peak current density decreased with increase of the 1-ethyl-3-methyl imidazolium fluoroboric acid concentration,which showed inhibition function of the 1-ethyl-3-methyl imidazolium fluoroboric acid to electroless copper deposition rate.
出处
《电镀与精饰》
CAS
北大核心
2012年第5期1-4,共4页
Plating & Finishing
关键词
化学镀铜
离子液体
溶剂
沉积速度
eletcroless copper plating
ionic liquid
solvent
deposition velocity
