摘要
在生产T/R组件时,低温共烧陶瓷(LTCC)的大面积焊接常常遇到钎透率偏低的情况。由于焊接面和焊片上存在污染和氧化层,因而焊接面和焊料润湿性偏差;由于大面积焊接时没有恰当的保护气氛和还原气氛,因而焊接面和焊料非常容易重新氧化;焊剂的不恰当使用也会产生一些焊剂残留:这一切都是钎透率偏低的重要原因。文中介绍了改善焊接面和焊料润湿性的一些有效方法,如等离子体化学清洗和新颖的氢等离子体再流焊接技术。采用这些先进技术可以实现大面积焊接的无焊剂化,这些先进技术在提高LTCC基板大面积焊接钎透率方面将发挥重要作用。
During T/R module assembly,the large area soldering coverage of low temperature cofired ceramics（LTCC） is usually low.Because of pollution and oxidization layer on soldering surface and soldering terminal,the wettability of soldering surface and soldering terminal is poor.Since there are no proper protective atmosphere and deoxidization atmosphere during large area soldering,the soldering surface and soldering terminal are reoxidized very easily.Besides,the improper use of the flux will produce some flux residues.All of these are important reasons why the large area soldering coverage is low.Some effective ways to improve the wettability of soldering surface and soldering terminal are introduced in this paper,such as plasma chemical cleaning and hydrogen plasma reflow soldering.These modern technologies can realize the large area soldering without flux and will play an important role in improving large area soldering coverage of LTCC.
出处
《电子机械工程》
2012年第2期52-56,共5页
Electro-Mechanical Engineering
