单搭接胶接接头应力分布研究

Study on Stress Distribution of Adhesively Bonded Single Lap Joints

胶接技术是一种重要的金属结构连接技术,其应用领域越来越广泛,已引起了很多业界人士的关注。以多种商品化环氧胶粘剂和Q235,45号钢、铜为对象,通过有限元数值分ansys8.0软件建立单搭接接头模型并且进行数值分析,对其在外力作用下金属基体上胶层中固化的轴向应力、剥离应力、X-Y平面剪应力和von Mises等效应力分布进行了定量模拟分析,研究了胶层拉伸过程中和拉伸后应力的变化。结果表明:有限元数值模拟中可以分析出的被粘物的轴向或等效应力是发生在被粘物胶结区应力集中的主要原因,被粘物越厚同时外力越大,越会出现很严重的应力集中。

The scope that the metal structures adopt the adhesively bonded single lap joints is extending gradually. This paper is based on the ansys8.0 software to set up the molds and number simulation and the objects such as Q235, XH-11,and then it is to analyze the axial stress Sx ,peel stress Sy; shear stress Sxy; and Von Mises equivalent stress Seqv occurred in epoxy adhesive bonded zone of pure adherends after tensile shear strength testing. The results obtained from the elasto-plastic finite element simulation show that the axial or equivalent stress overrun the yield strength of the adherend is the main reason of the stress concentration occurred in the bonded zone of the adherends after the strength testing. The thicker its adherends is, the more serious the stress concentration. The bigger the stress is, the more serious the stress concentration is.