摘要
各向异性导电胶膜(ACF)作为一种新型的互连材料,被越来越广泛地应用在各类智能卡中。简述了ACF的结构特点,连接原理,并详细介绍了ACF在不同类型智能卡中的互连应用,以及ACF粘接工艺和工艺参数。
The anisotropic conductive films,a kind of new material for interconnection,have been used more and nore widely in smart card market.In this paper, the applications of ACF for interconnection in different kinds of smart cards were introduced.And the ACF construction,bonding technology and key parameters in the bonding process were described.
出处
《粘接》
CAS
2012年第5期78-81,共4页
Adhesion