期刊文献+
任意字段
题名或关键词
题名
关键词
文摘
作者
第一作者
机构
刊名
分类号
参考文献
作者简介
基金资助
栏目信息

各向异性导电胶膜(ACF)特性及其在智能卡中的应用 被引量：2

Characteristics of anisotropic conductive films and their application in smart card for interconnection
下载PDF
导出
摘要 各向异性导电胶膜(ACF)作为一种新型的互连材料,被越来越广泛地应用在各类智能卡中。简述了ACF的结构特点,连接原理,并详细介绍了ACF在不同类型智能卡中的互连应用,以及ACF粘接工艺和工艺参数。 The anisotropic conductive films,a kind of new material for interconnection,have been used more and nore widely in smart card market.In this paper, the applications of ACF for interconnection in different kinds of smart cards were introduced.And the ACF construction,bonding technology and key parameters in the bonding process were described.
作者 杨青
机构地区 [
出处 《粘接》 CAS 2012年第5期78-81,共4页 Adhesion
关键词 智能卡 各向异性导电胶膜(ACF) 工艺 smart card ACF bonding process
分类号 TQ437 [化学工程]
  • 相关文献

参考文献7

  • 1Liu J,Lai Z.Overview of conductive adhesive joining technology electronics in electronics packaging applications[A].Proceedings of the 3rd International Conference on Adhesive Joining and Coating Technologyin Electronics Manufacturing[C]. 1998.1 - 17.
  • 2黎文部,王洛礼,于洁.各向异性导电胶粘剂膜的研究进展[J].电子元件与材料,2006,25(2):4-7. 被引量：3
  • 3吴丰顺,郑宗林,吴懿平,邬博义,陈力.倒装芯片封装材料—各向异性导电胶的研究进展[J].电子工艺技术,2004,25(4):139-142. 被引量：14
  • 4蔺永诚,陈旭.各向异性导电胶互连技术的研究进展[J].电子与封装,2006,6(7):1-7. 被引量：9
  • 5Chan Y C,Luck D Y.Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects flip-chip-on-flex packages assembly I.Different bonding temperature[J].Microelec- tronics Reliability,2002 (42):1185-1194.
  • 6Sarkar G,Mridha S,Chong T T.Flip chip interconnect using anisotropic conductive adhesive[J].Journal of Material Processing Technology, 1999(90):484-490.
  • 7Chen X,Zhang J,Jiao C L,et al.Effects of different bonding parameters on the electrical performance and peeling strengths of ACF interconnection [J].Microelec- tronics Reliability,2006 (46).

二级参考文献40

  • 1Chan Y C,Luk D Y.Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II Different bonding pressure[J].Microelectronics reliability,2002,42:1195-1204.
  • 2on Klosterman,Li Li,James E Morris.Materials characterization,conduction development,and curing effects on reliability of isotropically conductive adhesives[J]. IEEE trans comp packg manuf technol,1998,21(1A):23-31.
  • 3Zakel E,Teutsch T.A roadmap to low cost bumping for DCA,COF,CSP and BGA [flip chip][C].Electronics manufacturing technology symposium,1998.55-62.
  • 4Aoqiang Lu,Wong C P.Mechanisms underlying the unstable contact resistance of conductive adhesives[C].Electronic components and technology conference,1999.342-346.
  • 5Yim M J,Paik K W.The contact resistance and reliability of anisotropically conductive film (ACF)[J].IEEE transactions on advanced packaging,1999,22(2).
  • 6Fan S F,Chan Y C.Effect of misalignment on the electrical characteristics of anisotropic conductive adhesive joints[C].Electronic components and technology conference,2002.1605-1612.
  • 7Miessner R,Aschenbrenner R,Reichl H.Reliability study of flip chip on FR4 interconnections with ACA [C].Electronic components and technology conference,2002.595-601.
  • 8Aschenbrenner R,Miessner R,Reichl H.Characterization of adhesive materials for hight circuit density applications[C].1998 International symposium on advanced packaging materials,1998.
  • 9Miho Yamaguchi.Development of noval anisotropic conductive file(ACF)[C].Electronic components and technology conference,1999.360-364.
  • 10Jean-charles Sourian,cyrille Rossat.Electronical conductive film for Flip-chip interconnection based on Z-aixs conductors [C].Electronic components and technology conference,2002.1151-1153.

共引文献22

同被引文献4

引证文献2

粘接
2012年 第5期

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部