摘要
综述近几年来文献报导的关于叠层片式陶瓷电子元件的研究现状。对叠层片式陶瓷电容器、叠层片式陶瓷压敏电阻、叠层片式陶瓷压电产品和叠层片式复合陶瓷电子元件分别作了阐述。指出叠层片式元件适应集成电路中电子元件小型化、高性能化及多功能化而出现的必然性,同时对该类元件在发展过程中出现的各种的问题进行分析,指出了其研究方向。
The recent achievements on the research of the multilayer chip ceramic devices are reviewed in this paper. The development of multilayer chip capacitors,multilayer chip vanstors,multilayer chip piezoelectric devices and multilayer chip composite ceramics were evaluated and summarized. The multilayer ceramics technology has provided a necessary way for the devices of IC circuits. Meanwhile,the exiting questions were summarized in this paper.
出处
《材料导报》
EI
CAS
CSCD
北大核心
2000年第5期33-35,共3页
Materials Reports
关键词
叠层片式元件
低温烧结
内电极
陶瓷电子元件
multilayer chip ceramic devices,low temperature sintering, internal electrode