期刊文献+

热成像系统图像处理电路的新进展 被引量:3

Latest progress of IR image system processing electronic
原文传递
导出
摘要 国外一流热成像厂商均研制了适宜其产品应用的新型高性能图像处理电路。选取了5套具有代表性的国外高性能处理电路,对其硬件设计构架、实现功能、以及对外接口三方面进行了对比分析。这些高性能处理电路的主要特点有:电路功能分模拟转换和数字处理两部分;数字处理电路以大规模FPGA为处理核心,并配以大量存储器,且广泛应用FPGA中的嵌入式核;在具备基本使用功能的基础上,继续在非均匀校正以及图像增强两个方向,应用效果更佳的算法;处理电路通常具备扩展能力;处理图像分辨率大于等于640×512像素;模拟视频采用VGA接口等。 Foreign first-class thermal imager manufacturers have developed new generation high-performance image processing electronics which are suitable for their products.A comparative analysis of hardware design architecture,functions and external interfaces is done for five representative sets of high-performance IR image processing electronics.Analysis shows: electronics is divided into analog processing part and digital processing part;a FPGA with plenty resource is used as a core processor,which associated with large memories,and embedded cores in the FPGA is widely used also;besides base image processing functions,better non-uniformity correction and image enhancement algorithms is applied to reinforce image performance;processing electronics usually have expansion capability and can deal with images which resolution is larger than or equal to 640×512 pixels;analog output is VGA;etc.
出处 《光学技术》 CAS CSCD 北大核心 2012年第3期362-366,共5页 Optical Technique
关键词 热成像系统 图像处理电路 FPGA thermal imager system processing electronics FPGA
  • 相关文献

参考文献7

  • 1King D F,Graham J S,Kennedy A M,et al.3rd-generationMW/LWIR sensor engine for advanced tactical systems[J].SPIE,2008,6940:69402R-1-12.
  • 2范永杰,金伟其,刘崇亮.前视红外成像系统的新进展[J].红外与激光工程,2010,39(2):189-194. 被引量:16
  • 3FLIR.Carthage[EB/OL].http://www.FLIR.com/cvs/eurasia/cn/content/?id=8824,2009-06-12.
  • 4Crawford S,Craig R,Haining A,et al.THALES long-waveadvanced IR QWIP cameras[J].SPIE,2006,6206:62060H-1-11.
  • 5Ovod Vladimir I,Baxter Christopher R,Massie Mark A,et al.Advanced image processing package for FPGA-based re-pro-grammable miniature electronics[J].SPIE,2005,5783(PARTI):304—315.
  • 6Baxter C R,Cicchi T R,Massie M A,et al.Miniature embed-ded real-time image processor system for smart sensor systems[J].SPIE,2004,5406(1):743—54.
  • 7Seibel E,Struckhoff A,McDaniel R.Long range hand heldthermal imager[J].SPIE,2006,6206:62062V-1-8.

二级参考文献9

  • 1蔡毅,胡旭.红外成像寻的用红外探测器现状和发展趋势[J].红外与激光工程,2006,35(1):7-11. 被引量:36
  • 2VIZGAITIS J N,MILLER J,HALL J,et al.3rd generation FLIR demonstrator[C]//SPIE,2008,6940:69400U-1-10.
  • 3VIZGAITIS J N.Third generation infrared optics[C]//SPIE,2008.6940:69400S-1-10.
  • 4VIZGAITIS J N.Dual f/number optics for 3rd generation FLIR systems[C]//SPIE,2005,5783:875-886.
  • 5KING D F,GRAHAM J S,KENNEDY A M,et al.3rd-generation MW/LWIR SenSor engine for advanced tactical systems[C]//SPIE,2008,6940:69402R-1-12.
  • 6NORTON P.Third-generation sensors for night vision[C]//SPIE,2005,5957:59571Z-1-15.
  • 7RADFORD W A,PATTEN E A.KING D F,et al.Third generation FPA development status at Raytheon vision systems[C]//SPIE,2005,5783,(1):331-339.
  • 8FINFROCK D K,KOLABDER W L.Thrid generation infrared system calibration using dual band thermoeloelectric thermal reference sources and test systems to calibrate uncooled IRFFAs[C]//SPIE,2008,6940:69400V-1-12.
  • 9RICHARDSON P,MILLER B,CHUN R,et al.Third generation FLIR simulation at NVESD[C]// SPLE,2007,6543:65430K-1-11.

共引文献15

同被引文献11

引证文献3

二级引证文献13

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部