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用作超大规模集成电路低k材料的有机薄膜 被引量:9

Organic films Used as low k dielectric materialin VLSI technology
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摘要 详细介绍了几种可用于超大规模集成电路的低介电常数有机薄膜材料 ,比如聚酰亚胺类有机薄膜、聚对二甲苯类有机薄膜和聚烯链类有机薄膜。比较了这几种薄膜之间的特性和制备工艺 ,并就薄膜的结构和制备方法对性能的影响做了进一步的探讨。 Several organic films such as PI、parylene-N and polyene film with low dielectric constant are introduced in detail,the characteristics of these films and the processes of their preparation are compared,and influences of the structure and processing of films on its properties are also discussed further.
出处 《微电子技术》 2000年第1期31-36,共6页 Microelectronic Technology
关键词 低K材料 集成电路 VLSI 有机薄膜 Low k Dielectric Material,Polyimide,CVD
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参考文献5

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