摘要
主要介绍了Sn -Pb合金焊接焊点发生失效的各种表现形式 ,探讨发生失效的各种原因及如何在工艺上进行改进以改善焊点的可靠性 。
All kinds of failures in solder joint are introduced,whose causes are studied.How to improve joint's quality and reliablity is also studied.
出处
《电子工艺技术》
2000年第2期70-73,共4页
Electronics Process Technology
关键词
焊点
质量
可靠性
合金
焊接
Solder joint
Failure
Quality
Reliability
