锡铅合金电镀

Terne Electroplating

主要论述印制线路板生产中所用的氟硼酸盐镀锡铅溶液。常用的有 5种添加剂 ,各有其特点和不足。为了得到满意的镀层 ,要严格工艺规范 ,还要经常分析镀液 ,用赫尔槽试验 ,共同控制镀液中Sn2 +和Pb2 +的浓度和相互比例。并举例说明如何分析调整补充电镀液。深入浅出地评述了电镀各因素 ,如分散能力和孔电阻 ,溶液的温度 ,阳极中锡铅比例等的影响。作者还以丰富的实践经验叙述了许多常见的不引起注意的问题 ,能有效地保证镀层质量。

Mainly discuss fluorborate terne electroplating solution in use for PCB fabrication.There are five additions generally,each has advantages and disadvantags.In order to get good plating layer,process specification should be strict,plating solution should be analysed,Sn 2+ and Pb 2+ concentration and mutual proportion should be conlrolled with Her tank test.At the same time,illustrate how to adjust and replenish plating solution,explain various elements of plating solution in simple terms,for example,disperse ability and hole resistance,solution tempreture,Sn and Pb proportion in anode and so on.The article also narrates many qestions in rich practicle experience which often doesn′t attract attention.Therefore plating layer quality is effectively ensured.