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微机电系统中热分析的几个问题 被引量:2

Several Issues of Thermal Analysis in the Microelectromechanical
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摘要 本文针对微传热学及其热分析给出一个理论描述 ,以期促进 MEMS设计理论及研究方法的发展 ,适应设计与制造技术趋于一体化研究的需要。 Aiming at promoting the development of the design theory and research method of the Microelectromechanical Systems(MEMS), and adapting to the demand of the tendency in which the research on the technology of design and fabricate will be integrated, this paper gives a theoretical description on Micro-Heat-Transfer and it′s thermal analysis.
出处 《电子机械工程》 2000年第1期42-43,47,共3页 Electro-Mechanical Engineering
关键词 微电子机械系统 微传热 Microelectromechanical Systems Micro-heat-exchange Residual Thermal Stress
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  • 1刘恩科.半导体物理学[M].北京:国防工业出版社,1997,6..
  • 2Hicks L D,et al.Thermoelectric figure of merit of one-dimentional conductor.Phys Rev B,1993,47:16631
  • 3Yu G,Gurevich,et al.New physical principles of contact thermoelectric cooling.Surf Rev Lett,2002,9:1703
  • 4Anatkychuk L I.Generalization in physics of thermoelectric energy conversion and new trends of thermoelectricity development.Proc 17th Int Conf on Thermoelectrics (ICT'98),1998.9
  • 5Brian C Sales.Novel thermoelectric materials.Science,1997,2:284
  • 6Francis J DiSalvo.Thermoelectric cooling and power generation.Science,1999,285:703
  • 7Brian C Sales.Smaller is cooler.Science,2002,295:1248
  • 8Lance Rushing,et al.Thermoelectric coolers for integrated applications.Proc 16th Int Conf on Thermoelectrics (ICT' 97),1997.646
  • 9Fleurial J P,Borshchevsky A,et al.Thermoelectric microcoolers for thermal management applications.Proc 16th Int Conf on Thermoelectrics (ICT'97),1997.641
  • 10Chu R C,Simons R E.Application of thermoelectrics to cooling electronics:review and prospects.Proc 17th Int Conf on Thermoelectrics (ICT'98),Nagoya,Japan,May,1998.270

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