摘要
介绍了倒芯片面阵式凸点制作、多层陶瓷基板焊盘制作及倒装焊各关键技术 ,并成功地获得了芯片与基板的互连。
This paper describes flip chip array bump fabrication,multi layer ceramic substrate fabrication and key technologies of flip chip bonding,and we have obtained succesfully interconnection between chip and substrate.
出处
《半导体情报》
2000年第2期40-44,共5页
Semiconductor Information
关键词
凸点
陶瓷基板
倒装焊
Bump Ceramic substrate Flip chip bonding Interconnection
