化学法在Ni-W基带上制备Ag缓冲层研究

Preparation of Ag buffer layers on Ni-W substrates with chemical method

在双轴织构的Ni-W基带上,采用化学镀银法为YBa2Cu3O7-δ(YBCO)涂层导体制备Ag缓冲层薄膜,并通过XRD和φ扫描研究烧结温度和镀银次数对Ag薄膜取向的影响。结果表明,在Ar-H2混合气氛下,于870℃镀银5次所制备的薄膜具有(200)晶面单一取向;采用化学法制备的Ag薄膜有较好的外延性,且适用于涂层导体中的单一导电型缓冲层。

Ag buffer layers were prepared on the biaxially textured Ni-W alloy substrates with chemical method for the YBa2 Cua O7-δ （YBCO）coated conductor. The effects of different heat treatment temperatures and silver plating times on the orientation of films were studied by XRD and φ-scan. The results show that Ag films with the preferential orientation of （200） can be prepared on Ni-W alloy substrates under Ar-H2 atmosphere and at 870 ℃ after silver plated 5 times. The Ag thin film prepared by chemical method has good extensionality, and is a promising single conductive buffer layer for the coated conductor.