摘要
近年来集成电路封装材料、设备及工艺技术研究进展迅速,尤其是封装材料及封装设备更是日趋完善。材料性能和设备能力已不再是SOT23系列产品达到MSL1要求的主要/关键限制因素。文章主要研究影响SOT23系列产品达到MSL1要求的工艺过程因素,寻求SOT23系列产品达到MSL1要求的工艺过程控制解决方案。通过对工艺过程中关键工序加工方法、工艺流程及工艺条件的试验,最终确定了可以稳定通过MSL1的方案,其主要做法是:在粘片后采用分段烘烤,在压焊和塑封前加等离子清洗以及对工序间间隔时间进行控制。
During these years, research on IC assembly materials, machines and technology have made significant development, especially for assembly materials and machines. Materials properties and machines performance are no longer the main/key limits for SOT23 series to reach MSL1. So this paper mainly discusses the influencing factors of technical process for SOT23 series of IC assembly, and seeks the solution of technical process for SOT23 series product to meet MSL1. By performing lots of experiments on key process method, process flow and process conditions, we made a plan which can meet MSL 1 stably. The main control points summarized like this： performing sectional baking after die bonding, doing plasma cleaning before wire bond and molding, and controling interval time during each process.
出处
《电子与封装》
2012年第5期1-4,10,共5页
Electronics & Packaging
