双孔离焦成像法齿条测量研究

A double-hole defocused imaging method for rack testing

提出一种基于双孔离焦成像的三维测量方法。通过在成像光路中加入掩膜版,使离焦物体通过掩膜版后在CCD上成双像,根据双像的相对位置,获得成像物体的空间三维位置。在分析相机成像模型的基础上,推导了离焦成像三维反演方法模型,分析了结构参数对测量精度的影响。搭建了三维测量仪器,对齿条进行测量实验,实验结果表明,本文方法能实现齿条等三维物体的快速,非接触测量,具有较高的测量精度,误差小于2μm。

This paper presents a method of three-dimensional（3D） measurement based on double-hole defocused imaging.This method adds phase masks in the imaging light path to make the defocused object have double images on the CCD,and according to the double images′ relative positions,the object′s three-dimensional position is acquired.Based on analyzing the camera imaging model,the paper deduces the three-dimensional inversion model of defocused imaging.The influence of the structural parameters on the measurement accuracy is alalyzed,the three-dimensional measurement system is established,and the rack measurement experiment is performed.The results show that this method can realize fast and non-contact rack measurement,and gets high measuring accuracy.