Si-Al合金电子封装材料性能及显微组织研究

Properties and the Microstructures of Si-Al Alloys for Electronic Packaging

采用热压烧结法制备了70%Si-Al和90%Si-Al两种合金,测量了两种合金的典型热性能和力学性能,并观察和对比了两种合金的显微组织。结果表明:随着Si含量从70%升高到90%,在各测量温度下,合金材料的线膨胀系数都降低。热压烧结制备的材料Si相细小,致密度高,界面结合力好,热导率高。随着Si相含量的增加,热压的Si-Al合金热导率逐渐降低。烧结的Si-Al合金的抗弯强度和弹性模量随Si相含量的增加逐渐降低,材料的断裂主要以Si相的脆性断裂为主。

The 70% Si-Al and 90% Si-Al alloys have been prepared by hot-press sintering. The thermal and mechanical properties of the alloys have been measured and the microstructures of the alloys have been observed. It is shown that the coefficient of linear expansion decreases when the content of Si increases from 70% to 90%. The thermal conductivity of hot-press Si-Al alloys decreases with the increase of Si content because the Si phase is more refined with less Si present in the alloys. The flexural strength and the elastic modulus decrease with the increase of Si content in Si-Al alloys. The fracture of Si-Al alloys is mainly due to the brittle fracture of the Si phase.