微梁无耗散弛豫动态过程分析及仿真

Analysis and simulation of micro-beam non-dissipative relaxation dynamic process

为探讨微机电系统中梁结构无耗散弛豫动力学特性,基于Euler-Bernoulli梁方程,引入两端绞紧梁边界条件,推导梁挠度无耗散弛豫理论表达式,并给出梁挠度振幅分布以及弛豫周期内挠度动态Maple算例。对微梁无耗散弛豫过程进行有限元仿真,结果表明,弛豫仿真周期与理论计算相符,梁挠度振幅仿真分布与算例有差异,大挠度弛豫振幅与初始挠度仿真比值与理论相差较大。

In order to explore characteristics of micro-beam non-dissipative relaxation dynamics of MEMS, the beam non-dissipative deflection relaxation expression was educed based on EulerBernoulli equation with boundary conditions of two hinged ends. The deflection amplitude distribution and deflection dynamic process in a relaxation period were calculated by Maple. The finite element simulation data of micro-beam non-dissipative relaxation indicated that relaxation period was agreement with theoretical calculation, deflection amplitude distribution was differed from calculation example used Maple, the ratio of relaxation amplitude to initial deflection was quite a difference compared with theory result when micro-beam has large deflection