Cu-Ni-P合金镀层的制备及性能

Preparation and Properties of Cu-Ni-P Alloy Deposits

在柠檬酸盐溶液中电沉积制备了Cu-Ni-P合金镀层.采用能谱(EDS)、X射线衍射(XRD)、扫描电镜(SEM)对合金的成分、结构、形貌进行了分析.用交流阻抗(EIS)和动电位极化曲线法研究了镀层的腐蚀性能.结果表明,电沉积方法制备的Cu-Ni-P合金镀层具有纳米晶结构,镀层表面平整、光亮.P的加入使Cu-Ni合金镀层的硬度和耐腐蚀性能得到提高.

The Cu-Ni-P alloy deposits were prepared by electrodeposition. Their composition, structural and morphology were characterized using X-ray diffraction （XRD）, energy dispersive spectrum （EDS） and scanning electron microscopy （SEM）. The corrosion behaviors of the deposits were evaluated by polarization curve and electrochemical impedance spectroscopy （EIS）. The results reveal that a coherent, compact and bright Cu-Ni-P alloy deposit can be prepared by electrodeposition from sulphate/citrate solution. The structure of the Cu-Ni-P alloy deposit is a single f. c. e-phase nano crystalline. The corrosion resistance can be improved significantly through codepositing element P into Cu-Ni alloy.