化学镀Ni-P基体的磷含量对亚硫酸盐镀金体系置换镀金层表面形貌的影响

Effect of Phosphorus Content in Electroless Ni-P Substrate on the Surface Morphology of Gold Coating Obtained from Sulfite-thiosulfate Immersion Gold Plating Bath

以亚硫酸-硫代硫酸盐镀金体系作为置换镀金液,在化学镀Ni-P镀层上制备了置换镀金层,并采用原子力显微镜分析了磷含量及置换镀金时间对镀金层微观表面形貌的影响.结果表明,磷含量越高,Ni-P基体耐腐蚀性能越好,镀金层表面越好,表面粗糙度越小;置换镀金时间为600s时,所得镀金层最为平整光滑,镀金时间越长,Ni-P基体受到腐蚀越大,所得镀金层表面粗糙度变大.

An immersion gold coating was obtained on electroless Ni-P substrate in the sulfite-thiosulfate gold plating bath. The effects of phosphorus content in electroless Ni-P substrate and the time of immersion gold on the surface morphology of gold coating were investigated by atomic force microscopy surface analysis. The results show that a higher phosphorus content often lead to a better corrosion resistance of the Ni-P substrate and a better surface morphology of the gold coating with a smaller surface roughness. A smooth gold coating was obtained at 600 s, The longer of the dipping time results in a larger of the corrosion of Ni-P substrate and a larger of the surface roughness of the gold coating.