高性能双组分室温固化环氧胶的研制

On preparation of room-temperature curable two-component epoxy adhesive with high bonding properties

以环氧E-51、增韧剂R-1000、偶联剂KH-560、聚酰胺651、酚醛胺和促进剂DMP-30为原料,制备了一种高粘接性能、双组分室温固化环氧胶。研究了DMP-30的用量对环氧胶适用期的影响;R-1000、KH-560的用量和A、B组分配比对环氧胶粘接性能的影响。结果表明,m_(聚酰胺+酚醛胺/m_(DMP-30)=100/12时,环氧胶的适用期为40～45min;m_(E-51)/m_(R-1000)=100/16、m_(E-51)/m_(KH-560)=100/2,m_A/m_B=3.0/1.0时,环氧胶的粘接性能最佳。

Using epoxy resin （E-51）,toughening agent （R- 1000）,coupling agent （KH-560）,polyamide 651 ,phenolic amine and accelerant （DMP-30） as the raw materials,a two-component room temperature curable epoxy adhesive with high bonding properties was prepared.The effects of DMP-30 amount on the pot life of epoxy adhesive and of the amounts of R- 1000 and KH-560 and weight ratio of A and B component on the bonding properties of epoxy adhesive were studied.The results showed that the pot life of epoxy adhesive is 40-45 min when m （polyamide-phenolic amine）/m （DMP-30） is 100/12;the epoxy adhesive bonding properties and optimal when m （E-51） /m （R-1000） ,m （E-51） /E （KH-560） and m （A） /m （B） are 100/16,100/2 and 3.0/1.0,respectively.