一种基于断层测量的反求工程

A Reverse Engineering System Based on Slicing Measurement

断层测量技术能同时测量物体的表面和内腔尺寸 ,在反求工程中具有较好的应用前景。现有方法如 CT和 MRI的测量精度较低 ,且成本很高。针对上述问题 ,研究了一种基于层去图像法的断层测量系统 。

Slicing measurement methods can acquire the shape data of both exterior and interior surfaces and regions of an object, which have great practical value for reverse engineering. Although computer tomography(CT) and magnetic resonance imaging(MRI) can nondestructively extract part contours, their measuring accuracy is low and the cost is very high. This paper presents the cross-sectional imaging measurement system, and describes its applications in reverse engineering.