大功率白光LED封装技术

Packaging Technology for High-Power White LED

近年来,大功率白光LED封装技术面临着巨大的挑战。在LED封装过程中,LED封装方法、材料、工艺和结构的选择,对LED的出光效率,可靠性,散热等方面有巨大的影响。本文从热学、电学和机械角度详细地评述了大功率白光LED封装技术。

Packaging technique of high-power white LED is facing enormous challenge in recent years. In the process of LED packaging, the selection of LED packaging methods, materials, processes and structure has a great influence on LED light extraction efficiency, reliability, cooling and so on. The packaging technique of high-power white LED was summarized in detail in the view of thermology, electrics and mechanics.