摘要
介绍了激光焊接机理和特点,分析了铝合金的激光焊接工艺特性,设计了激光焊接密封接头结构。通过对铝合金封装壳体的激光焊接密封工艺试验和分析,研究了装配间隙、材料表面状态、焊接工艺参数和工装夹具等因素对焊接密封质量的影响,成功实现了良好焊缝质量的焊接,达到微波组件氦气泄漏率低于1×10-8Pa.m3/s的密封要求。
Describe the mechanical principles and the characteristics of laser seal welding, and analyse the technologica properties of laser welding for aluminium alloys, and design the sealing joint of laser welding. Through the laser seal welding of the aluminium alloy package, study the effect of the factors such as assembly clearance, samples, parameters and fixture on welding quality, achieve good welding, reach the sealing requirements for below 1 × 10^-8 Pa.m^3/s of microwave modules.
出处
《电子工艺技术》
2012年第3期148-151,共4页
Electronics Process Technology
关键词
微波组件
铝合金封装
激光焊接密封
Microwave modules
Aluminium alloy package
Laser seal welding experiments for surface state of helium leak rate
