摘要
LED作为第四代照明光源已被广泛应用于显示、照明等领域,但是由于LED结点温度直接对LED寿命及可靠性造成较大影响,所以如何降低LED结点温度成为现今研究的热点课题。提出了一种利用冷喷涂技术优化LED散热途径的方法,并利用ANSYS软件对其进行了模拟对比,证明采用冷喷涂结合锡焊技术、降低铜基板厚度可有效降低LED散热热阻。
LED is called the fourth generation of lighting, which has already been widely used in display and il lumination devices and so on. The junction temperature has directly influenced upon the life time and reliability of high-power LED, so keeping the junction temperature of LED is a key issue. A method researching radiators based on cold spray technology was introduced. The heat performance of LED packaging was simulated by ANSYS , it shows that using cold spray technology and soldering, reducing the thickness of copper substrate can effectively reduce the thermal resistance of LED.
出处
《材料导报》
EI
CAS
CSCD
北大核心
2012年第12期158-160,共3页
Materials Reports
基金
国家自然科学基金(50276073)
关键词
LED散热
ANSYS
冷喷涂技术
锡焊
heat dissipation of LED, ANSYS, cold spray technology, soldering
