摘要
采用表面组装SnPb焊点形态的势能控制方程 ,对片式元件RC32 16的三维焊点形态进行了数值模拟。基于焊点体系的势能数据 ,分析了片式元件的焊点间隙和贴片误差的自调整作用。结果表明 ,焊点间隙随焊点钎料量的增加而近似线性增加 ;焊点间隙和焊点钎料量的增加有助于贴片误差的自调整作用 ,并提出了焊点间隙的一种回归模型。
By employing the potential energy controlling equation for SnPb solder joint formation in surface mount technology,the 3D solder joint geometry were numerically simulated.Based on the calculated potential energy data for the solder joint system,the stand off height and the self alignment effects for misaligned placement were investigated.The results show that the stand off height increases near linearly with the increase of solder volume.The increases of stand off height and solder volume can enhance the self alignment of chip component.Moreover,a regression model for stand off height was put forward.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2000年第1期71-74,共4页
Transactions of The China Welding Institution
关键词
表面组装
片式元件
焊点形态
间隙
自调整
钎焊
SMT,chip component,solder joint geometry,stand off height,self alignment
