贵金属合金焊粉制造

Preparation Technology of Soldering Powder

焊膏在电路元件和微型集成电路的贴装技术 (SMT)中是关键材料 ,焊膏的印刷性、粘度、粉末氧化、塌边 (坍塌 )性及搅溶性都取决于焊粉的性质。作者概述了五种焊粉的制造方法 (机械合金化法、气体喷雾法、离心喷雾法、振动喷雾法和旋转喷雾法 )及其特征 ,焊粉的成分和性质 ,粉末形状对焊膏性能的影响 ,焊粉的分级方法。并对气体喷雾法和离心法进行了比较。今后焊粉制造技术将向离心喷雾装置与高效分级装置相结合的方向发展。目标是以低的生产成本 ,制造氧化程度小 ,粒度分布范围窄及真圆球状的焊粉。

The soldering paste has been used widespreadly in circuit element and the surface mounting technology of integrated circuit.Soldering powder is the key material in the soldering paste production and there fore decides the property of the paste the printability,viscosity,oxidation,collapasibility and the mixing-solubility of the paste are decided by the property of powder.In the paper,five preparation methods of paste(mechanical alloying,gas-centrifugal-vibratim and rotation-spraying method)and their characteristic are studied.The composition and property of powder,the influence of shape on property and the classificating methods are studied also.The gas spraying method and the centrifugal method are compared in the paper.In order to produce the real spherical soldering powder with low cost and low oxidation level as well as narrow size distribution,in the near future the centrifugal spraying equipment should be developed joining the efficient classificating equipment in proccessing technology.