摘要
随着表面安装和芯片安装时代的到来,下游客户对电路板平整度的要求必定越来越严格。本文围绕印制电路板设计和制造的全流程,重点研究了压合、阻焊、整平、出货前校平等制程对板件变形的影响。并根据试验结果和生产经验提出了一些有效的控制板件变形的方法。
Printed circuits board assembly factories need more strict control on PCB flatness because of the coming stage of SMT and BGA packaging technology. The author study on the key process such as lamination and solder mask on PCB manufacturing to find up the root cause and method to reducing twist on PCB products.
出处
《印制电路信息》
2012年第7期11-14,共4页
Printed Circuit Information
关键词
变形
压合
twist
lamination
