摘要
主要论述了印制电路板化学镀铜所采用的电引发起镀技术及其作用机理,同时给出其应用方法。
This article mainly introduced the electro-induced deposition in PTH process and its effect mechanism, meanwhile, its application method is given out.
出处
《印制电路信息》
2012年第7期25-27,54,共4页
Printed Circuit Information
关键词
电引发
化学镀铜
机理
应用
Electro-induced
Electroless Copper
Mechanism
Application